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XPENG-W Kicks off Industry's First Chip Upgrade Crowdfunding from Tdy
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XPENG-W (09868.HK)(XPEV.US) announced the launch of the industry's first chip upgrade crowdfunding activity from today (11th), and the event will last until December 12. He Xiaopeng, Chairman of XPENG-W, said that, with the implementation of the end-to-end foundation model, the company hopes to move from the Pro version of the Xiaopeng Motors NOA to the Max version. Through this crowdfunding campaign, XPENG-W will bring an upgraded smart driving chip and cockpit chip to existing users. Pursuant to the plan, users can participate in crowdfunding during the period to upgrade single Orin chip models to dual Orin chips, and upgrade the 820A cabin chip to the more advanced 8295 chip. This crowdfunding will be carried out model by model, and once the target amount is reached, preparations for the relevant models will officially kick off. AAStocks Financial News |
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