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<IPO>WILL (603501.SH) Reportedly Plans to Raise Up to $7.8B in HK IPO
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A semiconductor designer in Mainland China, WILL (603501.SH), with plans to raise up to USD1 billion (approximately HKD7.8 billion), has picked CICC and UBS as joint sponsors, according to foreign media citing informed sources. The board of directors of WILL approved the relevant proposal last Friday (23rd), which will subsequently be submitted to the shareholders' meeting for voting. The specific issuance details are still under negotiation, with the listing schedule and scale subject to adjustments. AASTOCKS Financial News Website: www.aastocks.com |
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